Instrumentation

The main concept of the LAREM instrumentation is based on the complex studies of samples by electron beam.

Scanning electron microscope CamScan CS 3200

LAREM is equipped with the scanning electron microscrope fitted with EDS, WDS and EBSD microanalytical systems. The samples can be pictured in secondary, back scattered or absorbed electrons, or it is possible to use the cathodolumiscence detector.

Microanalytical system Link ISIS 300 with the EDS SiLi spectrometer (Oxford Instruments)

The energy dispersive spectrometer containing the silicon crystal dopped with lithium forms the core of the microanalytical system Link ISIS 300. This system is applied mainly to the analysis of the rock-forming minerals (silicates). Link ISIS 300 provides fast and precise tool for analysis of elements in range over B – U.

Microanalytical system WDX 3PC with the WDS spectrometer (Microspec)

The wave dispersive microanalytical system WDX 3PC enables spectral analysis of the x-ray radiation using diffraction on the selected crystal. The chemical composition of the particular sample is obtained from the detailed analysis of the spectrum using correction methods (ZAF, Phi-Ro). The WDS system provides us with the chemical analysis with the very low detection limits (elements in range over O-U).

Electron backscatter diffraction system (EBSD) NORDLYS II (HKL Technology)

The EBSD system is based on the detection of diffracted backscattered electrons. The diffraction patterns are processed by Channel 5 software (HKL Technology).

Complementary instrumental equipment

KOMPAKT grinder/polisher with automatic holders APX (MTH Hrazdil)

LAREM is equiped with the special grinder/polisher, which is designed for preparation of the samples by chemical polishing. High quality surface of the sample prepared by the chemical polishing  is required when using the EBSD system.

The precise saw MIKRON 3000

is used for the preparation of clean and precise cuts for oriented samples studied by EBSD. It is able to prepare extremely thin cuts (0,03 mm) for a special applications. Low speed cutting with low strain eliminates the structure deformation of the material under preparation.